1/1
Camera Memory Card SMT Assembly PCBA – High‑Precision PCB for NAND Flash, Controller IC & Passive Components with BGA/CSP Capability
No.YQQX032
- High‑Density SMT Assembly – Supports Ultra‑fine Pitch Components: 0.4mm BGA (Ball Grid Array), CSP (Chip Scale Package), 01005 Passives, and Micro‑SD Card Connectors. Suitable for NAND Flash, EMMC, UFS Memory Modules, and Controller ICs.
- Advanced Process Technologies – Vacuum Placement for BGA (Void Rate <15% Per IPC‑7095), Nitrogen‑Reflow Soldering, 3D AOI, and X‑Ray Inspection for Hidden Solder Joints (BGA, LGA). Ensures <50ppm Defect Rate.
- Custom Substrate Options – Rigid PCB (FR4, 0.6‑1.2mm), Flexible (Polyimide), or Rigid‑Flex Designs. Gold‑Plated Contacts (ENIG, 0.05‑0.1µm Au) for Wear‑Resistant Card Edge Connectors (MicroSD/SD/CFexpress).
- Testing & Quality Control – 100% Electrical Test (Open/Short), In‑Circuit Test (ICT) for Passive Values, Functional Test with Custom Test Boards (Read/Write Speed Verification), and Thermal Cycling (-25°C to +85°C, 500 Cycles) for Industrial‑Grade Cards.
- Cleanroom Environment – Class 100,000 (ISO 8) Cleanroom for Contamination‑Sensitive Memory Assembly. Ionic Contamination <1.56µg/cm² (Per IPC‑6012DA). ESD‑Protected Workstations.
- Applications – Suitable for: SD/MicroSD Memory Cards (Consumer, Industrial), CFexpress Cards (High‑Speed Video), EMMC Modules for Embedded Systems, USB Flash Drive PCBs, Automotive‑Grade Memory (AEC‑Q100 Qualified Components), and Custom Form‑Factor Memory Cards (PSRAM, MRAM).
(0 Reviews)
0 Sold
Product Overview
Camera Memory Card SMT Assembly PCBA refers to the high‑precision surface‑mount technology (SMT) assembly of printed circuit boards used in memory cards (SD, microSD, CFexpress, eMMC, etc.) for cameras, drones, smartphones, and industrial embedded systems. These PCBs typically host a NAND flash memory chip (raw flash), a controller IC, passive components (resistors, capacitors, crystals), and a card edge connector (gold‑plated contacts). The assembly process demands extremely high accuracy due to fine‑pitch BGA/CSP packages (0.4‑0.5mm ball pitch), tight impedance control for high‑speed interfaces (UHS‑II, PCIe), and reliability requirements for data retention (10+ years).
As the global memory card market continues to serve photography, video production, surveillance, and automotive sectors, this PCBA assembly service provides manufacturers with a reliable, high‑yield solution for producing memory cards that meet SD Association, CF Association, and JEDEC standards.
1/1
